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Wafer-level packaging
Results: 24

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21	Brokerage H2020 Call ICT2 – 2014 Partner Presentation: NANIUM S.A[removed]Partner and contact person: NANIUM S.A., Vila do Conde, Porto, Portugal Steffen Kröhnert, Director of Technology Expertise and Activities: Add to Reading List Source URL: ec.europa.eu Language: English - Date: 2014-03-10 05:00:00 Technology Embedded Wafer Level Ball Grid Array Three-dimensional integrated circuit Qimonda Integrated circuit packaging Wafer-level packaging Semiconductor device fabrication Electronics Microtechnology
22	Brokerage H2020 Call ICT2 – 2014 Partner Presentation: NANIUM S.A[removed]Partner and contact person: NANIUM S.A., Vila do Conde, Porto, Portugal Steffen Kröhnert, Director of Technology Expertise and Activities: Add to Reading List Source URL: ec.europa.eu Language: English - Date: 2014-03-10 05:00:00 Technology Embedded Wafer Level Ball Grid Array Three-dimensional integrated circuit Qimonda Integrated circuit packaging Wafer-level packaging Semiconductor device fabrication Electronics Microtechnology
23	Performance analysis of OFDM modulation on indoor broadband PLC channels Add to Reading List Source URL: www.mnsl-journal.com Language: English Microtechnology RF MEMS Microelectromechanical systems Wafer bonding Microfabrication Micro-Opto-Electro-Mechanical Systems Integrated circuit Wafer-level packaging Etching Materials science Semiconductor device fabrication Technology
24	PDF Document Add to Reading List Source URL: www.globalsmt.net Language: English - Date: 2008-02-04 15:39:14 Electromagnetism Semiconductor device fabrication Institute of Electrical and Electronics Engineers Wave soldering Rework Solder Restriction of Hazardous Substances Directive Printed circuit board Wafer-level packaging Electronics manufacturing Electronics Technology

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